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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/16 tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 tsz22111 ? 14 ? 001 www.rohm.com resistive type touch screen controller ics BU21024FV-M general description unlike most resistive t ouch screen controllers, the bu21024 4-wire resistive touch screen controller enables dual-touch detection and gesture recognition. these intelligent controllers expose a set of registers to a host processor and are configured through software. the controllers can detect single point coordinates, dual coordinates, pinch, spread, rotate left and rotate right gestures, enabling pan and zoom operations in applications that previously had to rely exclusively on capacitive touch technology. resistive touch does not require custom screen development which reduces development cost, and results in faster time to market across a family of products. features ? enables single touch, dual touch & gesture recognition using standard 4-wire resistive touch screens ? adjustable touch detection threshold allows fine tuning of pressure sensitivity for an application ? enables measurement of single point touch pressure ? spi- and i 2 c interface for interfacing to host processor ? programmable interrupt polarity ? 10-bit adc provides sufficient resolution for finger or stylus inputs ? firmware for internal cpu may be downloaded from host processor or from an eeprom ? includes filtering options to eliminate false coordinates ? built in support for intelligent calibration ? easy to swap x & y coordinates or adapt to different touch screen connections ? single 3v power supply ? available in small packages and temperature ranges ? ideally suited for large volume automotive, consumer, and industrial applications ? aec-q100 qualified packages w(typ) x d(typ) x h(max) ssop-b28 10.0mm x 7.60mm x 1.35mm applications ? products with an lcd can benefit from pan and zoom operations. ? smart phones, digital cameras, video cameras, gps receivers, printers, copiers, automotive navigation screens, touch kiosks ? tablet pcs , notebook computers, lcd displays (with usb interface) ? car navigation system, car audio key specifications and lineup parameter BU21024FV-M screen 4-wire resistive touch screens maximum detection point 2 integrated filter process yes gesture detection yes supplied voltage range(v) 2.7 to 3.6 temperature range(c) -40 to +85 host i/f 4-wire spi 2-wire serial pakage ssop-b28 downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 2/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m pin configuration and pin description no. pin name i/o function figure 1 eda i/o eeprom sda c 2 ecl o eeprom scl c 3 ynm i/o screen interface (test input) e 4 xnm i/o screen interface (test input) e 5 ypm i/o screen interface (test input) e 6 xpm i/o screen interface (test input) e 7 yn i/o screen interface e 8 xn i/o screen interface e 9 yp i/o screen interface e 10 xp i/o screen interface e 11 t4 i/o test pin e 12 pvdd o regulator output (for supply screen voltage) - 13 avdd o regulator output (for supply analog block) - 14 dvdd i/o regulator output (for supply digital block) or supply digital voltage - 15 dvdd_ext i digital voltage enable (h=hi-z , l=dvdd enable) e 16 vdd - supply voltage - 17 vss - ground - 18 rstb i h/w reset e 19 clk_ext i supply external clock for debug a 20 t1 i test pin a 21 t2 i test pin a 22 t3 i test pin a 23 ifsel i interface select pin (l=spi, h=2-wire serial) a 24 so o spi serial data output 2-wire - f 25 int o interrupt output c 26 sel_csb i spi chip select 2-wire slave address select c 27 sda_si i/o spi serial data input 2-wire serial data in-out c 28 scl_sck i spi serial clock input 2-wire serial clock input c 1. please use 1.0f capacitors between avdd and dvdd to gnd, and leave pvdd terminal open. 2. if dvdd_ext=h , the dvdd pin can be connected to an external 1.8v power source. 3. please pull up the ecl, eda, and int pins using 10k ohm resistors as shown in the application diagram at the end of this doc ument. ecl and eda pins may be directly connected to gnd if an external eeprom is not being used. please connect a 0.1f capacitor between t4 and gnd. t1, t2 & t3 pins should be connected to gnd. 4. when using the 2 wire serial interface, please pull up the scl_sck, sda_si pins via 10 k ohms and leave so unconnected. 5. please note that the values of resistors and capacitors mentioned here are only recommended values. 6. rstb should be held low until supply voltage vdd has ramped up and has reached a stable level. 7. the polarity of int pin is programmable via register 0x30 8. connect clk_ext to gnd for normal use 9. please leave the xpm, xnm, ypm, ynm te rminals open if they are not being used. 10. int terminal is used as input pin in test mode. i _ _i _ _ i _ i top view downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 3/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m i/o equivalence circuit pad pad pad pad pad cin figure i/o equivalent circuit figure a figure b figure c figure d figure e figure f downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 4/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m block diagram and description of each block screen i/f 4-wire or 8-wire resistive touch screen interface adc 10-bit a/d converter osc internal 20mhz oscillator block with optional external clock input regulator internal regulator provides 1.8v dvdd supply. dvdd can also be supplied from an external source if dvdd_ext pin is tied high. clock generator system clock and timing generation (10mhz cpu clock) cpu core for dual touch processing, programmability and host interface work memory data memory for cpu program memory program memory for cpu. code can be downloaded by host processor or from an external eeprom eeprom i/f to connect to external eeprom when downloading program memory from eeprom. use of external eeprom is optional. host i/f 4-wire spi or 2-wire i 2 c interface provides access to registers downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 5/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m absolute maximum ratings parameter symbol rating unit conditions power supply voltage v dd -0.3 to +4.5 v input voltage v in -0.3 to v dd +0.3 v power dissipation pd 0.85 (note 1) w storage temperature range tstg -50 to +125 c (note 1) derate by 8.50mw /c centigrade when ambient temperat ure exceeds 25c. measured using pcb(1 layer) measuring 70x70x1. 6mm 3 . caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit conditions min typ max power supply voltage v dd 2.70 3.00 3.60 v digital core power supply dv dd 1.62 1.80 1.98 v dvdd_ext=h operating temperature rang e topr -40 +25 +85 c note: the bu21024 controllers can be operated with a single 3v v dd supply. it is also possible to supply 1.8v dv dd from an external source if the dvdd_ext pin is connected to logic high. electrical characteristics (ta=25 c, v dd =3.00v) parameter symbol limit unit conditions min typ max low-level input voltage v il -0.5 - 0.2xv dd v high-level input voltage v ih 0.8xv dd - v dd +0.5 v low-level output voltage v ol - - 0.4 v high-level output voltage v oh v dd -0.4 - - v standby current i st - - 1 a rstb=l sleep current1 i cc1 - 60 100 a dvdd_ext =l sleep current2 i cc2 - 10 20 a dvdd_ext =h operating current i dd - 4 6 ma no load oscillation frequency freq 18 20 22 mhz resolution ad 1024x1024 bit differential non-linearity error dnl -3.0 - +3.0 lsb integral non-linearity error inl -3.0 - +3.0 lsb downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 6/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m host-i/f mode (4-wire spi) (sck=scl_sck, si=sda_si, csb=sel_csb, so=so) i i w a 6 w a 5 w a 4 w a 3 w a 2 w a 1 w a 0 w d 7 wd 6 wd 5 wd 4 w d 3 w d 2 wd 1 wd 0 wd 7 wd 6 w d 5 wd 1 wd 0 gi i + i i + n i a r a 6 r a 5 r a 4 r a 3 r a 2 r a 1 r a 0 gi 0 1 a rd 7 rd 6 rd 5 rd 4 rd 3 rd 2 rd 1 rd 0 rd 7 rd 6 rd 5 rd 1 rd 0 a + a a + n z z condition : v dd = 3.0v ta=25c parameter symbol limit unit conditions min typ max csb setup time t 1 30 - - ns sck "h" level period t 2 30 - - ns sck "l" level period t 3 30 - - ns si setup time t 4 20 - - ns si holding time t 5 20 - - ns csb holding time t 6 20 - - ns csb "h" level time t 7 50 - - ns data output delay time t 8 - - 15 ns sck frequency t 9 - - 15 mhz note: spi interface is selected by tying ifsel pin to logic low. ifsel= logic high selects the 2-wire interface downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 7/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m host-i/f mode (2-wire serial) (scl=scl_sck, sda=sda_si) the 2-wire serial mode presents an i 2 c interface for all practical purposes, but it is not a complete implementation conforming to the i 2 c specification. BU21024FV-M dev ices can co-exist with other i 2 c devices on the same bus. the slave address for 2-wire serial communication is 5ch or 5dh. this is determined by the sel_csb pin. sel_csb = l : slave address = 5ch sel_csb = h : slave address = 5dh parameter symbol limit unit conditions min typ max scl clock frequency f scl 0 - 400 khz start condition hold time t hd:sta 0.6 - - s scl l t low 1.3 - - s scl h t high 0.6 - - s data hold time t hd:dat 0.1 - - s data setup time t su:dat 0.1 - - s stop condition setup time t su:sto 0.6 - - s s slave address w a register address a a p 7bit = 5ch or 5dh 8bit s slave address w a register address a s r a read data n p 7bit = 5ch or 5dh 8bit 8bit sp r w a n = acknowledge (sda low) = not acknowledge (sda high) from slave to master = stop condition = data direction read (sda high) = data direction write (sda low) slave address 7bit = 5ch or 5dh from master to slave = start condition ? write protocol write data ? read protocol sda scl address ack ack ack data data t hd;sta t su;sto t su;dat t hd;dat sda scl downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 8/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m eeprom i/f (scl=ecl , sda=eda ) bu21024 controllers include an eeprom interface for firmware download. device address of eeprom is set via register 0x51(eeprom_addr). timing chart parameter symbol limit unit condition min typ max scl clock frequency f scl 270 310 350 khz start hold time t hd:sta 0.7 - 0.9 s scl l width t low 1.4 - 1.8 s scl h width t high 1.4 - 1.8 s data hold time t hd:dat 0.7 - 0.9 s data setup time t su:dat 0.7 - 0.9 s stop setup time t su:sto 0.7 - 0.9 s protocol *ic does not support the write command. *ic supports the following read command. sda scl address read /write ack ack ack data data t hd;sta t su;sto t su;dat t hd;dat downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 9/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m background information a resistive touch screen is made up of mult iple layers of sandwiched resistive films and protective coatings all sitting on top of an lcd display. resistive touch screens work by direct contact of a stylus or a fi nger flexing a pair of resistive films, he nce any blunt pointing instrument or a gloved finger may be used. touch screen resolution the resolution of a touch screen is typically measured in dots per inch (dpi) and is a function of the physical size of the tou ch screen and the adc used in the conversion circuitry. for ex ample, a 3x5 screen used with the bu21024 devices can provide a theoretical resolution of 1024 /5 = 204 dpi. in the case of re sistive touch screens, the direct contact nature of its operation and finger thickness often impose an upper limit on the effective system resolu tion that may be achieved, regardless of the resolution of the adc itself. description of function the bu21024 devices connect to a standard 4-wire resistiv e touch screen on one side and to a host processor on the other side. the bu21024 includes f our additional sense terminals allowing it to be used with either 4-wire or 8-wire resistive touch screens. the bu21024 include the analog and digital circui try to process and provide dual touch coordinate data and pinch, spread gesture information to the host . the bu21024 devices include an internal cpu and provide a high degree of programmability by exposing a set of registers that can be accessed by a host through spi or i 2 c serial interfaces. the ifsel pin determines whether spi or i 2 c interface is selected, the bu21024 devices include an int pin whose polarity can be programmed via registers. when an interrupt occurs, for example, due to touch detection, the host processor is required to read an interrupt status r egister to determine the cause of the interrupt and take appropriate action. the program memory of the internal cpu may be initialized via the host interface or via an external eeprom. this is selected by a register setting. the bu21024 devices support two sensing modes ; continuous and interval sensing mode s, that are register- selectable. in the continuous sensing mode, the embedded cpu reads z, x & y coordinates continuously when a touch is detected. the interval sensing mode allows a delay to be inserted between each cycle. the bu21024 devices enable optimization of touch detection threshold for a given screen. they also include several sophisticated calibration algorithms. often, a description of the registers followed by flow charts r equires other document to explain the steps in finer detail. the other document also includes information on touch screen parameters that one sh ould look for when selecting resistive touch screens for multi-touch. downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 10/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m application examples BU21024FV-M supports 2 host interfaces (4-wire spi and 2-wire serial bus). the figures shown below are application circuits when each interface is used. *please connect the terminal of ecl/eda to g nd, when downloading the firmware form the host. ecl and eda pins pull up to vdd if an external eeprom is used. (example : 10k ? ) *please insert tvs diode or zener diode to each sensor line to enhance resistance to esd. *please pull up the int terminal to vdd or host io voltage (max 4.5v). *in the case of 4-wire spi use, please pull down the so terminal to gnd. if not in use, connect it to the gnd. example 3: BU21024FV-M application circuit (4-wirespi) in the case of 2-wire serial interface use, please pull up the int, scl_sck, sda_si terminal to vdd or host io voltage(max4.5v). example 4: BU21024FV-M application circuit (2-wire serial bus) downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 11/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m BU21024FV-M has monitor terminals(xpm, ypm, xnm, ynm) another interface terminals(xp, yp, xn, yn). the monitor terminals are used in touch screen voltage moni tor that 4port(0x30[2]) set to 0. the monitor terminals open and 4port(0x30[2]) set to 1 if they are not being used. the monitor terminals also helps in increasing the screens dynamic range by reducing error due to pcb wiring resistance. - i _ _i _ _ i _ eeprom panel vdd 10kohm 10kohm vdd vdd (10kohm) 0.1uf 1.0uf 1.0uf tvs diode host vdd 10kohm option(1) (1) eeprom interface pin.in using case: 10kohm pull-up. no-use case: connect to gnd. (2) for higher esd protection. (3) for lcd-noise protection. (4) for rf-noise protection. 470pf 10 ohm 10 ohm 10 ohm 10 ohm 470pf 470pf 470pf option(4) 1.0uf option(2) 1nf 10 ohm 1nf 10 ohm 1nf 10 ohm 1nf 10 ohm option(3) example 5: BU21024FV-M application circuit (4-wirespi, using monitor terminals) - i _ _i _ _ i _ 0.1uf 1.0uf 1.0uf vdd host (1) eeprom interface pin.in using case: 10kohm pull-up. no-use case: connect to gnd. (2) for higher esd protection. (3) for lcd-noise protection. (4) for rf-noise protection. (5) please connect to vdd when use as slave address = bah(7bit:5dhw/r bit). 1.0uf vdd io vdd 10kohm option(5) eeprom vdd 10kohm 10kohm vdd option(1) panel tvs diode 470pf 10 ohm 10 ohm 10 ohm 10 ohm 470pf 470pf 470pf option(4) option(2) 1nf 10 ohm 1nf 10 ohm 1nf 10 ohm 1nf 10 ohm option(3) example 6: BU21024FV-M application circuit (2-wire serial bus, using monitor terminals) downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 12/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider t he effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 13/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m operational notes - continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction thr ough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interfer ence among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore , do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in t he electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. others in case of use this ic, please peruse some other detail doc uments, we called functional description, application note. downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 14/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m ordering information b u 2 1 0 2 4 f v - m e 2 part number package fv : ssop-b28 product rank m : product of automotive rank packaging and forming specification e2: embossed tape and reel marking diagrams 1pin mark ssop-b28(top view) bu21024 part number marking lot number downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 15/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m physical dimension tape, and reel information package name ssop-b28 (BU21024FV-M) ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin (unit : mm) pkg : ssop-b28 drawing no. : ex156-5001 (max 10.35 (include.burr)) downloaded from: http:///
bu21023gul bu21023muv BU21024FV-M 16/16 datasheet datasheet tsz02201-0l5l0f300190-1-2 ? 2014 rohm co., ltd. all rights reserved. 31.mar.2014 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bu21024fv - m revision history date revision changes 07.oct.2013 001 new release 07.feb.2014 002 remove bu21023gul/muv descriptions 31.mar.2014 003 modified application circuit and option descriptions downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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